Adjusting an optimization parameter to customize a signal eye for a target chip on a shared bus

ABSTRACT

The embodiments of the present disclosure identify a target chip from among multiple chips coupled to a shared bus and customize an optimization parameter for the particular chip. Stated differently, in a communication system where only one chip (or a subset of chips) on a shared bus is the intended target, the system can customize an optimization parameter for the specific location of the target chip on the bus. As new data is received that is intended for a different chip—i.e., the target chip changes—the system can dynamically change the parameter based on the location of the new target chip on the bus.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of co-pending U.S. patent applicationSer. No. 14/794,041, filed Jul. 8, 2015. The aforementioned relatedpatent application is herein incorporated by reference in its entirety.

BACKGROUND

The present invention relates to adjusting a signal eye, and morespecifically, to adjusting the signal eye upon identifying a target chipcoupled to bus shared by multiple chips.

When designing traditional DDR3 fly-by nets, control settings such asthe I/O impedance and slew rate of a driver are set depending on thedistances of the DRAM modules from the driver. Generally, for anincreasing number of loads on a fly-by net, the driver impedance is setlower and the slew rate is set higher. If the DRAM modules are too close(electrically) to the driver, the received signal at these modules mayhave a poor signal eye which results in incorrectly latched data. Thetypical solution is to add electrical length between the driver and thefirst DRAM module on the net, which causes the chain of DRAM modules toappear more like a single load from the perspective of the driver.Although this improves the signal quality at the DRAM module closest tothe driver, the extra trace length causes more attenuation in the signalas it propagates down the net. As a result, the last DRAM module on thenet may receive a degraded signal eye that is below receiver thresholds.As data transmission rates increase, identifying suitable controlsettings that permit all the DRAM modules on the fly-by net to properlyreceive the signal becomes a difficult, if not impossible task.

SUMMARY

One embodiment of the present invention is a method that includesreceiving data to transmit on a shared bus, where a plurality of chipsand a plurality of dynamic resistors are coupled to the shared bus. Themethod also includes evaluating the received data to identify at leastone target chip of the plurality of chips, where the target chip is anintended recipient of the received data. The method includes adjusting,based upon a location of the target chip on the shared bus, a resistancevalue of a dynamic resistor of the plurality of dynamic resistorscoupled to the shared bus at a location closest to the location of thetarget chip on the shared bus and transmitting the received data on theshared bus using a driver while the dynamic resistor is at the adjustedresistance value.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 illustrates a communication system with multiple chips coupled toa shared bus, according to one embodiment described herein.

FIG. 2 is a flow chart for adjusting driver control settings uponidentifying a target chip on the shared bus, according to one embodimentdescribed herein.

FIG. 3 illustrates a communication system with multiple chips coupled toa shared bus, according to one embodiment described herein.

FIG. 4 is a flow chart for adjusting a dynamic termination resistor uponidentifying a target chip on the shared bus, according to one embodimentdescribed herein.

FIG. 5 illustrates a communication system with multiple chips andcorresponding dynamic resistors coupled to a shared bus, according toone embodiment described herein.

FIG. 6 is a flow chart for adjusting a dynamic resistor corresponding toa target chip on the shared bus, according to one embodiment describedherein.

FIGS. 7A and 7B illustrate DRAM memory systems, according to oneembodiment described herein.

FIG. 8 illustrates a data structure for identifying optimizationparameters in a DRAM memory system corresponding to target DRAMs,according to one embodiment described herein.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. It is contemplated that elements disclosed in oneembodiment may be beneficially utilized on other embodiments withoutspecific recitation.

DETAILED DESCRIPTION

Instead of identifying optimization parameters for all the chips coupledto a shared bus to accurately receive transmitted data, the embodimentsof the present disclosure identify a target chip on the shared bus andthen optimize a parameter for the particular chip. Stated differently,in a communication system where only one chip (or a subset of chips) ona shared bus is the intended target, the system customizes anoptimization parameter based on the specific location of the target chipon the shared bus. As new data that is intended for a different chip isreceived—i.e., the target chip changes—the system can dynamically changethe optimization parameters based on the location of the new target chipon the bus. Thus, even if the current optimization parameters result ina signal eye that does not satisfy receiver thresholds at the otherchips coupled to the shared bus—i.e., non-target chips—this does notmatter since the data is only intended for the target chip.

In one embodiment, the communication system includes a driver thattransmits a data signal onto a shared bus coupled to multiplesemiconductor chips. In one example, the chips may be memories such asDRAM memory modules or NAND flash. Moreover, the shared bus may be usedto transmit command/address data or data information to be stored in thememories (e.g., DQ signals). In one embodiment, the communication systemmay change an I/O impedance of the driver and/or its slew rate (referredto herein as “control settings”) depending on which chip is the intendedtarget of a data transmission. If the target chip is the chip closest tothe driver, the driver impedance may be set to 20 ohms with a slew rateof 500 ps. If the target chip is the chip furthest from the driver onthe shared bus, the impedance and slew rate may be changed to 15 ohmsand 50 ps, respectively. Additionally or alternatively, thecommunication system may dynamically change a termination resistancedepending on which of the chips is the target for the data transmission.For example, a dynamic termination resistor (e.g., a digitallycontrolled potentiometer) may be disposed on an end of the shared busopposite the end coupled to the driver. Depending on which chip is thetarget, the system may change the resistance value of the terminationresistor to optimize the signal eye at the location of the target chipon the shared bus.

In another embodiment, the communication system may include multipledynamic resistors coupled to the shared bus which each correspond to oneof the chips. When a target chip is identified, the communication systemmay set the value of the dynamic resistor corresponding to the targetchip to a specific resistance value. Moreover, the communication systemmay alter the resistance values of the other dynamic resistors so thatthe signal eye at the target chip is improved. Additionally oralternatively, the system may disable the other non-target chips (e.g.,switch the chip to a Hi-Z mode). The communication system may modifyall, or a subset of, the optimization parameters discussed above (e.g.,I/O impedance, slew rate, a termination resistor, dynamic resistorscoupled to each chip, or signals to activate/deactivate the chips) tooptimize signal quality at the location of the target chip on the sharedbus.

FIG. 1 illustrates a communication system 100 with multiple chips 130coupled to a shared bus 125, according to one embodiment describedherein. In addition, system 100 includes a driver 105 and a terminationresistor 135 coupled to respective ends of the shared bus 125. Thesystem 100 may also include state signals 140 for selectively activatingand deactivating the chips 130 (e.g., switching the chips 130 from aHi-Z mode (inactive) to a Low-Z mode (active)), although this is not arequirement.

In one embodiment, the communication system 100 may be memory system(e.g., DRAM or NAND flash) where command/address data or DQ signals aretransmitted from the driver 105 to a chip 130. However, the embodimentsherein may be used in any communication system 100 where only one chip(or a subset of the chips) coupled to the shared bus is the intendedtarget of a data transmission from the driver 105. For example, thecommunication system 100 may be used to perform Ethernet communicationto transmit network packets to different targets (e.g., chips 130) whenthe packet is intended for a subset of the targets connected to the bus.

In one embodiment, the chips 130 are attached to different locations ofthe shared bus 125 such that the chips 130 are different distances fromthe driver 105 and the termination resistor 135. These distances referto the length of the shared bus 125 (e.g., a trace length) thatseparates a particular chip 130 from the driver 105, the terminationresistor 135, or another chip 130. Although shown as being a straightline, the shared bus 125 may have any number of bends or curves. Thus,it is possible that the shared bus 125 may have an arrangement where theclosest chip 130 to the driver 105 according to the length of the sharedbus 125 may actually be further from the driver 105 than another chip130 if direct paths where used to compare distances between the driver105 and the chips 130.

In one embodiment, when transmitting a data transmission, the driver 105sends the data to all the chips 130 indiscriminately. Put differently,the system 100 does not include any switching logic that permits only asubset of the chips 130 coupled to the shared bus 125 to receive thedata transmission. Instead, the data transmission is received on all ofthe chips 130. However, because of the different locations of the chips130 on the bus 125, the signal quality of the data transmission (i.e.,the signal eye) varies for the chips 130. For example, back reflectionsand/or attenuation may affect the data transmission at the variouslocations of the chips 130 differently. Thus, the quality of the datatransmission at the chip 130 closest to the driver 105 may be differentthan the quality of the data transmission at the chip 130 furthest fromthe driver 105. Moreover, the speed at which the driver 105 transmitsthe data transmission also affects the back reflections and/orattenuation thereby affecting the signal quality at the locations of thebus 125 coupled to the chips 130.

To account for the signal quality at the various locations along theshared bus 125, the system 100 may attempt to balance control settingsin the driver 105 and the termination resistor 135 so that the signaleye at the various chip locations on the bus 125 is sufficient for eachchip to receive data. That is, all the chips 130 can receive and processthe data transmission even if the chip 130 is not the intended target ofthe data transmission. However, fixing the control settings so that allthe chips 130 can receive the data transmission may limit the speeds atwhich the driver 105 can transmit the data. For example, all the chips130 may be able to accurately receive the data transmission at 1600mega-transfers/second, but for the same control settings, only a portionof the chips 130 can accurately receive the data if the data rate isincreased to 2100 mega-transfer/second. Instead of using static controlsettings which are set so that all the chips 130 can receive the datatransmission, the communication system 100 dynamically adjusts thecontrol settings of the driver 105 using the location of the intendedtarget chip 130 on the shared bus 125 even if doing so means some of thechips 130 on the bus 125 are unable to accurately receive the datatransmission.

The driver 105 includes configuration logic 110 for identifying theintended target for a received data transmission (i.e., a particularchip 130 or chips 130) and adjusting the control settings of the driver105 accordingly. The configuration logic 110 stores an I/O impedancevalue 115 and slew rate value 120 for the driver 105. The driver 105 mayreceive data from an upstream source (not shown) such as a hostprocessor or memory controller which is intended for only one of thechips 130. The configuration logic 110 may process the received data toidentify which of the chips 130 is the target chip. Once identified, theconfiguration logic 110 may reference an internal or external memory toidentify control settings corresponding to the target chip. Theconfiguration logic 110 may update the I/O impedance 115 or slew rate120 settings (or both) of the driver 105 according to the predefinedsettings. In this manner, the configuration logic 110 optimizes one ormore control settings of the driver 105 (i.e., the driver's I/Oimpedance 115 or slew rate 120) to adjust the signal quality of the datatransmission for the particular location of the target chip 130 on theshared bus 125.

The configuration logic 110 may be firmware, hardware, software, or somecombination thereof. Moreover, as shown as being part of the driver 105,in other embodiments, the configuration logic 110 may be located on aseparate integrated circuit from the driver 105, or on a controller(e.g., a memory controller) separate from the driver 105.

FIG. 2 is a flow chart illustrating a method 200 for adjusting drivercontrol settings upon identifying a target chip on the shared bus,according to one embodiment described herein. The method 200 begins atblock 205 where a driver receives data intended for one of the pluralityof chips coupled to a shared bus. In one embodiment, the data may beintended for only one of the plurality of chips. Alternatively, the datamay be intended for a subset of the plurality of chips—e.g., two out offour chips. As described above, the data may be a command/address datafor a particular memory chip, or DQ data to be stored on the chip.Alternatively, the data may be an Ethernet communication packet destinedfor a processor chip or controller chip coupled to the shared bus.

At block 210, configuration logic identifies a target chip from theplurality of chips using information in the received data. For example,the received data may include a chip number or identifier whichspecifies one of the chips coupled to the shared bus. Alternatively, thereceived data may include address data which the configuration logicuses to identify the chip. For example, different blocks of addressesmay be assigned to the chips, and thus, by identifying which blockincludes the address in the received data, the configuration logic canidentify the target chip. In another example, the configuration logicmay evaluate a packet header for identifying the destination of thepacket—i.e., the target chip.

At block 215, the configuration logic adjusts the slew rate and/or theI/O impedance for the driver which transmits the received data onto thedata bus. For example, the configuration logic may update internalregisters that set the I/O impedance (e.g., 15 ohms, 20 ohms, 30 ohms,etc.) and the slew rate (e.g., 50 ps, 100 ps, 500 ps, etc.) for thedriver. Stated differently, the configuration logic can adjust thesecontrol settings in response to identifying the target chip and itslocation on the shared bus.

In one embodiment, the configuration logic may perform a testing orconfiguration phase when a communication system is first powered on. Theconfiguration logic may test the different possible combinations of theI/O impedances and slew rates for the driver and see which combinationsresult in the chips accurately receiving test data and for which datatransmission rates. For example, the configuration logic may determinethat a first chip accurately receives test data transmitted at a rate of1600 mega-transfers/sec when an I/O impedance of 15 ohms and 500 ps isused but a second chip does not. Instead, the second chip may need animpedance of 20 ohms and 100 ps to accurately receive the data at thetransmission rate. The configuration logic may identify the controlsettings for the chips in the bus for multiple different datatransmission rates—e.g., 1600, 1800, and 2100 mega-transfers/second.This information may be stored in a memory in the configuration logicwhich can then be referenced at block 215.

In another embodiment, the optimized control settings for the differentchips may be pre-loaded into the configuration logic instead ofperforming a testing or calibration phase when the communication systemis powered on. For example, a technician may use testing equipment or asimulator to determine the control settings that yield the best signalquality (i.e., the best signal eye) for each of the chip locations onthe shared bus for the various data transmission rates and store thesecontrol settings into the configuration logic before the communicationsystem is shipped to the customer.

In one embodiment, the control settings may be set for a group of chipsrather than for each individual chip. For example, instead of a singlerow of chips 130 as shown in FIG. 1, the system 100 may include multiplerows of chips 130 in a split fly-by topology which is shown in FIG. 7B.The control settings may be set depending on which row the target chipis in. Stated differently, the configuration logic may have differentcontrol settings for each row rather than for each chip. Thus, thecontrol settings may be the same regardless of which chip in the row isthe target chip.

At block 220, the driver transmits the received data on the shared bus.Thus, each of the chips coupled to the shared bus receive the signalgenerated by the driver although it may be the case that only a subsetof the chips can accurately decode the data represented by the signal.For example, the signal quality of the data transmission may beinsufficient to permit one or more of the chips to read the digitaldata. For example, the signal eye may be closed at some locations alongthe shared bus thereby prohibiting the chips coupled to these locationsfrom decoding the data transmission signal. However, so long as theintended target (or targets) can accurately identify the digital data inthe data transmission, the fact the signal quality may be too poor forthe non-target chips to receive the data does not matter.

At block 225, the configuration logic determines if additional data isreceived from a source. If not, method 200 ends. However, if additionaldata is received, method 200 returns to block 210 to determine thetarget chip for the new received data. The configuration logic canadjust the control settings based on the new target chip (assuming thenew target chip corresponds to different control settings than thecurrent control settings of the driver). In this manner, method 200dynamically adjusts the control settings of the driver as the targetchip for the data transmitted on the shared bus changes.

FIG. 3 illustrates a communication system 300 with multiple chips 130coupled to a shared bus 125, according to one embodiment describedherein. The system 300 is similar to the communication system 100 inFIG. 1 except that system 300 includes a dynamic termination resistor320 and control signal 325. Unlike a static resistor, the resistancevalue of the dynamic termination resistor 320 can change in response tothe control signal 325. For example, configuration logic 310 may use thecontrol signal 325 to change the resistance value of the dynamictermination resistor 320 from 40 ohms to 20 ohms, or vice versa.

Like in FIG. 1, the configuration logic 310 can adjust the I/O impedance115 and slew rate 120 for the driver 305 depending on which chip 130 isthe target chip. In addition, the configuration logic 310 includes atermination setting 315 which sets the resistance value of the dynamictermination resistor 320. In one embodiment, once the target chip isidentified, the configuration logic 310 determines a resistance value ofthe resistor 320 that corresponds to the target chip and uses thetermination setting 315 and control signal 325 to dynamically adjust theresistance value of the termination resistor 320. For example, the logic310 may set the resistance value of the termination resistor 320 to 30ohms when the chip 130 closest to the driver 305 is the target chip butchange the resistance value to 15 ohms when the chip 130 furthest fromthe driver 305 is the target chip.

As shown, the control signal 325 is transmitted along a communicationlink that is separate from the shared bus 125. Thus, the driver 305 mayuse a different communication technique to transmit the control signal325 than data on the shared bus 125. As such, the driver 305 may use adifferent data interface to transmit the control signal 325 to thetermination resistor 320 than the data interface used to transmitreceived data on the shared bus 125. The speed at which the driver 305transmits the control signals 325 may be the same or slower than thespeed at which data signals are transmitted on the shared bus 125.

In one embodiment, the configuration logic 310 may dynamically adjustthe termination resistor 320 without dynamically adjusting the controlsettings of the driver 310—e.g., the impedance 115 and slew rate 120.For example, those values may be fixed regardless of which chip 130 isthe target chip, and the configuration logic 310 instead varies theresistance value of the termination resistor 320 as the target chipvarious. However, being able to vary both the control settings of thedriver 305 and the dynamic termination resistor 320 based uponidentifying the target chip may be preferred since this might enable thedriver 305 to transmit at high data transmission speeds. Nonetheless, itmay be cheaper to manufacture the communication system 300 if it adjustsonly one of the control settings of the driver 305 or the resistancevalue of the termination resistor 320.

The system 100 may also include state signals 140 for selectivelyactivating and deactivating the chips 130 (e.g., switching the chips 130from a Hi-Z mode (inactive) to a Low-Z mode (active)), although this isnot a requirement. For example, the configuration logic 310 maydeactivate the non-target chips 130 while leaving the target chipactivated. Doing so may improve the signal quality of the transmitteddata at the location of the target chip on the shared bus 125. Moreover,although the configuration logic 310 is shown as being disposed on thedriver 305, this is not a requirement.

FIG. 4 is a flow chart illustrating a method 400 for adjusting a dynamictermination resistor upon identifying a target chip on the shared bus,according to one embodiment described herein. Blocks 405 and 410 may bethe same as blocks 205 and 210 in FIG. 2, and thus, will not bedescribed in detail here.

At block 415, configuration logic adjusts at least one resistance valueof the dynamic termination resistor coupled to an end of the shared busbased on the target chip. That is, the configuration logic changes thedynamic termination resistor to a resistance value that corresponds tothe target chip. For example, the configuration logic may perform atesting or configuration phase when the communication system 300 shownin FIG. 3 is first powered on. The configuration logic may test thedifferent possible resistance values of the termination resistor todetermine which of the chips accurately receive the test data at one ormore data transmission rates. For example, the configuration logic maydetermine that the first chip accurately receives test data transmittedat a rate of 1600 mega-transfers/sec when the termination resistor hasan impedance of 15 ohms but the second chip does not. Instead, thesecond chip may need a termination resistance of 20 ohms to accuratelyreceive data at this data transmission rate. The configuration logic mayidentify the termination resistance values for each of the chips on theshared bus for the different data transmission rates—e.g., 1600, 1800,and 2100 mega-transfers/second. This information may be stored in amemory in the configuration logic which can then be referenced at block415. Alternatively, the mapping of resistance values to the chips may bepre-loaded into the configuration logic rather than performing a testingor calibration phase. Moreover, as discussed above, the configurationlogic may also change the I/O impedance and/or slew rate of the driverin addition to adjusting the termination resistance upon identifying thetarget chip.

In one embodiment, the configuration logic uses a communication linkseparate from the shared bus 125 to adjust the termination resistor tothe resistance value that corresponds to the target chip. For example,the communication system may include a separate trace that connects anintegrated circuit on which the configuration logic is disposed to thedynamic termination resistor. However, in other embodiments, it may bepossible to adjust the value of the termination resistor using theshared bus if, for example, the target chip has a communication link tothe termination resistor for adjusting its resistance.

At block 420, the driver transmits the receiver data on the shared buswith the new adjusted resistance value of the dynamic terminationresistor. In one embodiment, the quality of the signal at one or more ofthe non-target chips on the shared bus may be below receiver thresholds.Thus, these chips may ignore the signal. However, since they are not thetarget for the transmitted data, this result is acceptable. Moreover, byadjusting the dynamic termination resistor in response to identifyingthe target chip (or chips), the transmission data rate may exceed whatwould be possible if the system had a static termination resistor wherethe resistance value does not change once it is set—i.e., once thecommunication system is powered on.

At block 425, the configuration logic determines if the driver receivesadditional data to be transmitted on the shared bus. If not, method 400ends. However, if additional data is received, method 400 returns toblock 410 to identify the target chip for the new data. If the data isfor the same target chip, then the configuration logic does not adjustthe termination resistor. Moreover, even if the target chip did change,this does not necessarily mean the configuration logic will adjust theresistance value of the termination resistor. That is, different chipscoupled to the shared bus may correspond to the same resistance value.Furthermore, the configuration logic may assign groups of chips on thebus the same resistance value. For example, the three chips closest tothe driver may correspond to a first termination resistance value, thenext three chips correspond to a second termination resistance value,and so forth. Thus, if the new target chip is within the same group asthe previous target chip, the configuration logic does not adjust theresistance value of the termination resistor.

FIG. 5 illustrates a communication system 500 with multiple chips 130and corresponding dynamic resistors 520 coupled to a shared bus 125,according to one embodiment described herein. The system 500 includes adriver 505 which transmits data on the shared bus 125 to the chips 130.As above, although all of the chips 130 receive the signal (even if thesignal quality is too poor for all the chips to identify the datarepresented by the signal), the transmitted data may be intended foronly a subset of the chips 130—i.e., a target chip or chips.

The system 500 includes multiple dynamic resistors 520 coupled to theshared bus 125. In one embodiment, the system 500 includes a respectivedynamic resistor 520 (or termination resistor 320) for each of the chips130 coupled to the shared bus 125. That is, each chip 130 corresponds toa respective dynamic resistor 520 where the last chip 130 (i.e., thechip 130 furthest from the driver 505) corresponds to the terminationresistor 320. Thus, the system 500 includes equal numbers of chips 130and dynamic resistors (i.e., dynamic resistors 520 and dynamictermination resistor 320).

The system 500 includes control signals 325, 525 to adjust theresistance values of the dynamic resistors 320, 520. Each of thesecontrol signals 325, 525 may correspond to an individual communicationlink (e.g., a trace), or the control signals 325, 525 may be transmittedon a shared link. Regardless, using the control signals 325, 525, thedriver 505 can individually adjust the resistance values of the dynamicresistors 320, 520 based on the current target of the data transmittedon the shared bus 125.

Like in communication systems 100 and 300, configuration logic 510includes I/O impedance 115 and slew rate 120 control settings for thedriver 505. However, unlike systems 100 and 300, the configuration logic510 stores multiple termination settings 515 for multiple dynamicresistors—i.e., resistors 320 and 520. In one embodiment, theconfiguration logic 510 stores termination settings 515 for each of thechips 130. Depending on which chip 130 is the target chip, the logic 510can use the corresponding termination settings 515 to set the resistancevalues for all the dynamic resistors 320, 520. Stated differently, theresistance values for each of the resistors 320 and 520 may changedepending on which of the chips 130 is the target. However, although theconfiguration logic 510 may adjust multiple dynamic resistors 320, 520depending on the target chip, in another embodiment, the logic 510 maychange only the dynamic resistor directly corresponding to the targetchip. For example, the driver 505 may use the state signals 140 todeactivate all the non-target chips 130 and use one of the controlsignals 325, 525 to adjust the dynamic resistor 320, 520 coupled to thesame location on the shared bus 125 as the target chip (i.e., the driver505 does not adjust the dynamic resistors 320, 520 corresponding to thenon-target chips). For instance, if the chip 130 furthest from thedriver 505 is the target chip, the configuration logic may adjust onlythe dynamic termination resistor 320 and leave the resistance values forthe dynamic resistors 520 unchanged. Furthermore, the driver 505 maydeactivate the non-target chips using the state signals 140.

FIG. 6 is a flow chart illustrating a method 600 for adjusting a dynamicresistor corresponding to a target chip on the shared bus, according toone embodiment described herein. Blocks 605 and 615 may be the same asblocks 205 and 210 in FIG. 2, and thus, will not be described in detailhere.

At block 615, configuration logic adjusts a resistance value of thedynamic resistor coupled to the target chip. In one embodiment, logicadjusts the resistance value of the dynamic resistor that is closest toa node at which the target chip is coupled to the shared bus. Statedifferently, the configuration logic adjusts the resistance value of thedynamic resistor that has the greatest effect on the signal quality atthe location of the target chip on the shared bus. In one embodiment,the dynamic resistor and the target chip are coupled to the samelocation on the shared bus.

In other embodiments, the configuration logic adjusts the resistancevalue of multiple dynamic resistors based on determining the target chipfor the data transmission. For example, the configuration logic mayadjust the resistance values for all the dynamic resistors coupled tothe shared bus (which may include a termination resistor) as the targetchip changes. The resistance values for the dynamic resistors may bedetermined during a testing/calibration phase or using a pre-loaded datastore.

At block 620, the configuration logic deactivates the non-target chips.In one non-limiting example, the configuration logic sets the non-targetchips in a Hi-Z mode. However, any method of deactivating the non-targetchips may be used. Furthermore, in some embodiments, the method 600 mayomit this step—i.e., the non-target chips may remain active.

At block 625, the driver transmits the received data on the shared bus625. In one embodiment, the quality of the signal at one or more of thenon-target chips on the shared bus may be below receiver thresholds.Thus, these chips may ignore the signal. However, since they are not thetarget for the transmitted data, this result is acceptable. Moreover, byadjusting one or more of the dynamic resistors in response toidentifying the target chip, the transmission data rate may exceed whatwould be possible if the system has only static resistors or only adynamic termination resistor.

At block 630, the configuration logic determines if the driver receivesadditional data to be transmitted on the shared bus. If not, method 600ends. However, if additional data is received, method 600 returns toblock 610 to identify the target chip for the new data. If the data isfor the same target chip, then the configuration logic does not adjustthe termination resistor. Moreover, even if the target chip did change,this does not necessarily mean the configuration logic will adjust theresistance value(s) of the dynamic resistor(s). That is, different chipscoupled to the shared bus may correspond to the same resistance valuesof the dynamic resistors.

FIGS. 7A and 7B illustrate DRAM memory systems, according to oneembodiment described herein. Specifically, FIG. 7A illustrates a printedcircuit board (PCB) 700 that includes a memory controller 705, DRAMmodules 745, and potentiometers 730 coupled to a shared bus 740. Thememory controller 705 may include a driver (not shown) for transmittingreceived data signals onto the shared bus 740. However, in otherembodiments, the driver may be separate from the memory controller 705(e.g., a separate buffer). In one embodiment, the memory controller 705and each of the DRAM modules 745 are each separate integrated circuitsor chips. Moreover, the potentiometers 630 may also be separatecomponents or may be integrated into the DRAM modules 745.

The memory controller 705 includes configuration logic 710 which maystore control settings for driving received data onto the bus 740 aswell as resistance values for adjusting the potentiometers 730. In thisexample, the logic 710 includes I/O impedance 715 and slew rate 720values which change depending on which DRAM module 745 is the targetmodule. For example, the shared bus 740 may be used to transmitcommand/address data to the DRAM modules 745. However, thecommand/address data may be intended for only one of the DRAM modules745. Thus, if a non-target DRAM module 745 receives the datatransmission, the module 745 determines the command/address instructionis intended for a different module and ignores the data. Thus, theconfiguration logic 710 can adjust the I/O impedance 715 and slew rate720 to optimize the quality of the transmitted signal at the location ofthe target DRAM module 745 on the shared bus 740. It does not matterthat the signal quality at the other DRAM modules 745 may be too poorfor these modules 745 to decode the signal since these modules 745 arenot the intended target.

The configuration logic 710 also includes potentiometer settings 725 foradjusting the potentiometers 730 based upon identifying the target DRAMmodule 745. For example, depending on which DRAM module 745 is thetarget, the configuration logic 710 may change the resistance values onall of the potentiometers 730. Alternatively, the configuration logic710 may change the resistance value on only one or some of thepotentiometers 730. The PCB 700 also includes state signals 750 whichthe configuration logic 710 may use to deactivate the non-target DRAMmodules 745. Although the configuration logic 710 in FIG. 7A can adjustthe driver control settings, the potentiometers 730, and the statesignals 750 each time the target chip changes, in other embodiments, thelogic 710 may adjust only a subset of these parameters.

FIG. 7B illustrates a PCB 750 where the DRAM modules 745 are arranged ina split fly-by topology. The shared bus is divided into two portions orlegs: first portion 740A and second portion 740B. The first and secondportions 740A, 740B are coupled at a first end to a common node that isalso connected to the memory controller 705. However, the second ends ofeach portion 740A, 740B are coupled to different termination resistors(e.g., potentiometers 730). As in the fly-by topology in FIG. 7A, thememory controller 705 transmits received data onto the two portions740A, 740B simultaneously. The signal representing the transmitted datais received at all the DRAM modules 745 although the signal quality maybe too poor for one or more of the DRAM modules 745 to demodulate thesignal and recover the data.

As above, the signal quality at the different locations of the DRAMmodules 745 along the portions 740A, 740B of the shared bus varyaccording to the I/O impedance 715, slew rate 720, potentiometersettings 725, and which modules 745 are active/inactive. Uponidentifying the target DRAM module 745 for a particular datatransmission (e.g., a command/address instruction), the configurationlogic 710 may adjust the I/O impedance 715, slew rate 720, potentiometersettings 725, and which modules 745 are active/inactive to optimize thesignal quality at the location of the shared bus coupled to the targetDRAM module 745. Thus, the techniques and embodiments described hereinmay apply to the fly-by topology and the split fly-by topology.Moreover, the embodiments herein may also be used to transmit DQ data toa target DRAM module in a memory system that includes multiple loads.

FIG. 8 illustrates a data structure 800 for identifying optimizationparameters in a DRAM memory system corresponding to target DRAMs,according to one embodiment described herein. The chart 800 may bereferenced by configuration logic in the DRAM memory system each time anew target chip is identified as a recipient for a command/addressinstruction or for DQ data. Moreover, chart 800 may be formed during atesting phase when the memory system is powered on or may be pre-loadedinto the system.

Chart 800 lists possible resistance values of a dynamic terminationresistor at row 805 and possible combinations of I/O impedance and slewrate of a driver at row 810. Once the target DRAM module is identified(e.g., DRAM01, DRAM02, etc.), the configuration logic can lookup thecorresponding optimization parameters for that module. For example, ifthe target is DRAM01, the configuration logic adjusts the resistance ofthe termination resistor to 15 ohms, the I/O impedance of the memorycontroller (or buffer) to 15 ohms, and the slew rate to 500 ps. In thismanner, the memory system is optimized to transmit data to DRAM01 eventhough doing so may mean that the signal is below receiver thresholdswhen received at the other DRAM modules (e.g., DRAM02 or DRAM 03).

Moreover, if the memory system includes respective potentiometers thatcorrespond to each of the DRAM modules, the chart 800 may be expanded toinclude values for these potentiometers. Further, the chart 800 mayinclude values for the state signals 750 shown in FIGS. 7A and 7B toindicate which DRAM modules should be deactivated when transmitting datato a target DRAM module. In one embodiment, the configuration logic maymaintain a different chart 800 for each of the data transmission ratesthe memory system may support since changing the transmission rate maychange the optimization parameters for each of the DRAM modules.

In one embodiment, the chart 800 may include optimization parameters fora group of DRAM modules rather than for each DRAM module as shown. Forexample, in a split fly-by topology, the chart 800 may use the sameoptimization parameters for all the DRAM modules in the same row of theshared bus. For example, if DRAM01, 02, and 03 were all connected on thesame row of the split fly-by net, the optimization parameters may be thesame. For example, the optimization parameters may ensure that each DRAMmodule of the row can accurately receive the data transmission even ifthat means DRAM modules on a different row on the shared bus cannot.

Aspects of the present invention may take the form of an entirelyhardware embodiment, an entirely software embodiment (includingfirmware, resident software, micro-code, etc.) or an embodimentcombining software and hardware aspects that may all generally bereferred to herein as a “circuit,” “module” or “system.”

The present invention may be a system, a method, and/or a computerprogram product. The computer program product may include a computerreadable storage medium (or media) having computer readable programinstructions thereon for causing a processor to carry out aspects of thepresent invention.

The computer readable storage medium can be a tangible device that canretain and store instructions for use by an instruction executiondevice. The computer readable storage medium may be, for example, but isnot limited to, an electronic storage device, a magnetic storage device,an optical storage device, an electromagnetic storage device, asemiconductor storage device, or any suitable combination of theforegoing. A non-exhaustive list of more specific examples of thecomputer readable storage medium includes the following: a portablecomputer diskette, a hard disk, a random access memory (RAM), aread-only memory (ROM), an erasable programmable read-only memory (EPROMor Flash memory), a static random access memory (SRAM), a portablecompact disc read-only memory (CD-ROM), a digital versatile disk (DVD),a memory stick, a floppy disk, a mechanically encoded device such aspunch-cards or raised structures in a groove having instructionsrecorded thereon, and any suitable combination of the foregoing. Acomputer readable storage medium, as used herein, is not to be construedas being transitory signals per se, such as radio waves or other freelypropagating electromagnetic waves, electromagnetic waves propagatingthrough a waveguide or other transmission media (e.g., light pulsespassing through a fiber-optic cable), or electrical signals transmittedthrough a wire.

Computer readable program instructions described herein can bedownloaded to respective computing/processing devices from a computerreadable storage medium or to an external computer or external storagedevice via a network, for example, the Internet, a local area network, awide area network and/or a wireless network. The network may comprisecopper transmission cables, optical transmission fibers, wirelesstransmission, routers, firewalls, switches, gateway computers and/oredge servers. A network adapter card or network interface in eachcomputing/processing device receives computer readable programinstructions from the network and forwards the computer readable programinstructions for storage in a computer readable storage medium withinthe respective computing/processing device.

Computer readable program instructions for carrying out operations ofthe present invention may be assembler instructions,instruction-set-architecture (ISA) instructions, machine instructions,machine dependent instructions, microcode, firmware instructions,state-setting data, or either source code or object code written in anycombination of one or more programming languages, including an objectoriented programming language such as Smalltalk, C++ or the like, andconventional procedural programming languages, such as the “C”programming language or similar programming languages. The computerreadable program instructions may execute entirely on the user'scomputer, partly on the user's computer, as a stand-alone softwarepackage, partly on the user's computer and partly on a remote computeror entirely on the remote computer or server. In the latter scenario,the remote computer may be connected to the user's computer through anytype of network, including a local area network (LAN) or a wide areanetwork (WAN), or the connection may be made to an external computer(for example, through the Internet using an Internet Service Provider).In some embodiments, electronic circuitry including, for example,programmable logic circuitry, field-programmable gate arrays (FPGA), orprogrammable logic arrays (PLA) may execute the computer readableprogram instructions by utilizing state information of the computerreadable program instructions to personalize the electronic circuitry,in order to perform aspects of the present invention.

Aspects of the present invention are described herein with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems), and computer program products according to embodiments of theinvention. It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycomputer readable program instructions.

These computer readable program instructions may be provided to aprocessor of a general purpose computer, special purpose computer, orother programmable data processing apparatus to produce a machine, suchthat the instructions, which execute via the processor of the computeror other programmable data processing apparatus, create means forimplementing the functions/acts specified in the flowchart and/or blockdiagram block or blocks. These computer readable program instructionsmay also be stored in a computer readable storage medium that can directa computer, a programmable data processing apparatus, and/or otherdevices to function in a particular manner, such that the computerreadable storage medium having instructions stored therein comprises anarticle of manufacture including instructions which implement aspects ofthe function/act specified in the flowchart and/or block diagram blockor blocks.

The computer readable program instructions may also be loaded onto acomputer, other programmable data processing apparatus, or other deviceto cause a series of operational steps to be performed on the computer,other programmable apparatus or other device to produce a computerimplemented process, such that the instructions which execute on thecomputer, other programmable apparatus, or other device implement thefunctions/acts specified in the flowchart and/or block diagram block orblocks.

The flowchart and block diagrams in the Figures illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods, and computer program products according to variousembodiments of the present invention. In this regard, each block in theflowchart or block diagrams may represent a module, segment, or portionof instructions, which comprises one or more executable instructions forimplementing the specified logical function(s). In some alternativeimplementations, the functions noted in the block may occur out of theorder noted in the figures. For example, two blocks shown in successionmay, in fact, be executed substantially concurrently, or the blocks maysometimes be executed in the reverse order, depending upon thefunctionality involved. It will also be noted that each block of theblock diagrams and/or flowchart illustration, and combinations of blocksin the block diagrams and/or flowchart illustration, can be implementedby special purpose hardware-based systems that perform the specifiedfunctions or acts or carry out combinations of special purpose hardwareand computer instructions.

While the foregoing is directed to embodiments of the present invention,other and further embodiments of the invention may be devised withoutdeparting from the basic scope thereof, and the scope thereof isdetermined by the claims that follow.

What is claimed is:
 1. A method comprising: receiving data to transmiton a shared bus, wherein a plurality of chips and a plurality of dynamicresistors are coupled to the shared bus; evaluating the received data toidentify at least one target chip of the plurality of chips, wherein thetarget chip is an intended recipient of the received data; adjusting,based upon a location of the target chip on the shared bus, a resistancevalue of a dynamic resistor of the plurality of dynamic resistorscoupled to the shared bus at a location closest to the location of thetarget chip on the shared bus; and transmitting the received data on theshared bus using a driver while the dynamic resistor is at the adjustedresistance value.
 2. The method of claim 1, wherein adjusting theresistance value of the dynamic resistor further comprises: transmittinga control signal on a communication link coupled to the dynamicresistor, the control signal providing the resistance value to thedynamic resistor, and wherein the communication link is separate fromthe shared bus.
 3. The method of claim 1, wherein the plurality of chipsand dynamic resistors are coupled at different locations to the sharedbus such that respective distances between the chips and the driver, andbetween the dynamics resistors and the driver, along the shared bus aredifferent.
 4. The method of claim 1, wherein each of the chips comprisesa DRAM memory module.
 5. The method of claim 1, further comprising:adjusting a respective resistance value of each of the plurality ofdynamic resistors based upon the location of the target chip on theshared bus, wherein each of the respective resistance values is changed.6. The method of claim 1, wherein at least one of the plurality ofdynamic resistors is a termination resistor coupled to a first end ofthe shared bus, wherein the driver is coupled to a second end of the busopposite the first end.
 7. The method of claim 1, further comprising:evaluating the received data to identify at least one non-target chip ofthe plurality of chips; and deactivating the non-target chip beforetransmitting the received data on the shared bus using the driver.